发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To improve manufacturing efficiency of electronic components in the method of manufacturing electronic components including an aging process. SOLUTION: An unbaked mother laminated layer material 112 constituted of a ceramic green sheet and a coil electrode is manufactured. Next, the unbaked mother laminated layer material 112 is press bonded. Next, a thermal aging step is conducted to the unbaked mother laminated layer material 112 by executing thermal treatment under a temperature higher than the normal temperature. The unbaked mother laminated layer material 112 is left under the normal temperature for the purpose of natural aging. Next, unbaked laminated layer material pieces is obtained by cutting the unbaked mother laminated layer material 112. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010093061(A) 申请公布日期 2010.04.22
申请号 JP20080261714 申请日期 2008.10.08
申请人 MURATA MFG CO LTD 发明人 MATSUSHIMA HIDEAKI;KUMAGAI AKINOBU
分类号 H01F17/00;H01F41/04 主分类号 H01F17/00
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