| 摘要 |
An MEMS microphone package includes a substrate, a cover, a plurality of conductive members, and an insulative adhesive. The cover is mounted to the substrate. The conductive members are disposed between the substrate and the cover. Each of the conductive members can be a golden wire, a conductive bump, or a conductive metal. Upper ends of the conductive members are connected with the cover and the lower ends of the conductive members are connected with the substrate to enable a conductive loop. The insulative adhesive encapsulates the conductive members. In this way, the substrate, the conductive members, and the cover jointly construct a shielding against EMI.
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