BONDING DEVICE, ULTRASONIC TRANSDUCER, AND BONDING METHOD

摘要

The invention relates to a bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as, in particular, electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in  particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). In order to further develop a bonding device of the abovementioned type, it is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). According to further aspects, the invention further relates to a bonding device or an ultrasonic transducer.