| 摘要 |
<p>Disclosed is a heat dissipation structure which can dissipate heat generated from a heat generating device efficiently, and is free from the production of dust such as carbon powder and projections of metal fibers that would have adverse effect on the electrical characteristics of the heat generating device. The heat dissipation structure (54) comprises a glass epoxy substrate (50) having a major surface (50a) on which a heat generating device (60) is mounted, and a heat dissipation sheet (52) consisting of a polypyrrole infiltration sheet. A front surface circuit pattern layer (62) consisting of a conductive material is formed on the major surface of the substrate, and a back surface circuit pattern layer (66) consisting of a conductive material is formed on the back surface (50b) thereof. The front surface circuit pattern layer (62) and the back surface circuit pattern layer (66) are conductive to each other via a through hole (64). The heat generating device is mounted so as to be in close contact with the front surface circuit pattern layer while sandwiching an insulating layer (68) therebetween. The heat dissipation sheet is kept in close contact with the back surface of the substrate, and a heat sink (56) is kept in close contact with the heat dissipation sheet.</p> |
