| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device having stable vibration characteristics by reducing the influence of a stress generated by heating a conductive bonding material (sealing material) embedded in a through-holes. SOLUTION: The piezoelectric device includes: an intermediate substrate 10 having a piezoelectric vibration section 11, a frame 12 for surrounding the piezoelectric vibration section 11, connection sections 15a, 15b for connecting the piezoelectric vibration section 11 to the frame 12, excitation electrodes 13, 14 provided on the main surface of the piezoelectric vibration section 11, resin protrusion sections 19a, 19b provided on the main surface of the frame 12 and having elasticity, and connection electrodes 23a, 33b including the surfaces of the resin protruding sections 19a, 19b and electrically connected to the excitation electrodes 13, 14; a lower substrate 30 as a base substrate bonded to the intermediate substrate 10 and having through holes 52a, 52b formed oppositely to the resin protruding sections 19a, 19b; and sealing sections 53a, 53b for sealing the through holes 52a, 52b and connected to the connection electrodes 23a, 33b on the surface of the resin protruding sections 19a, 19b. COPYRIGHT: (C)2010,JPO&INPIT |
