| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding pad to be connected with a taper-shaped redistribution line. <P>SOLUTION: An integrated circuit structure comprises a semiconductor substrate having a front side and a rear side. A through-silicon via (TSV), which passes through the semiconductor substrate, has a rear end extending to the rear side of the semiconductor substrate. A redistribution line (RDL), which is formed at the rear side of the semiconductor substrate, is connected at the rear end of the TSV. A passivation layer is formed at an opening formed at such a portion on the RDL, and an upper front surface and a sidewall portion of the RDL are exposed at an opening. A metal-finishing layer, which is formed at the opening, comes in contact with the upper front surface and the sidewall portion of the RDL. <P>COPYRIGHT: (C)2010,JPO&INPIT |
