发明名称 EPOXY RESIN COMPOSITION, PREPREG, AND LAMINATE AND PRINTED WIRING BOARD
摘要 The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks. This epoxy resin composition includes: (A) an epoxy resin; (B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent, (C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and (D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A). The epoxy resin composition exhibits, when cured into an article, a linear coefficient (az) of thermal expansion of 48 or less with respect to a thickness of said article.
申请公布号 US2010096173(A1) 申请公布日期 2010.04.22
申请号 US20080527853 申请日期 2008.02.21
申请人 发明人 FUJINO KENTARO;SAWADA TOMOAKI;NISHINO MITSUYOSHI;SHINPO TAKASHI;NAKAMURA YOSHIHIKO;YAMAGUCHI MAO
分类号 H05K1/00;B32B15/092;C08K3/22 主分类号 H05K1/00
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