COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
摘要
Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
申请公布号
WO2010011578(A3)
申请公布日期
2010.04.22
申请号
WO2009US51044
申请日期
2009.07.17
申请人
KLA-TENCOR CORPORATION;REICH, JUERGEN;VINTRO, LOUIS;DIGHE, PRASANNA;STEINBACH, ANDREW;KAVALDJIEV, DANIEL;BIELLAK, STEPHEN
发明人
REICH, JUERGEN;VINTRO, LOUIS;DIGHE, PRASANNA;STEINBACH, ANDREW;KAVALDJIEV, DANIEL;BIELLAK, STEPHEN