| 摘要 |
PROBLEM TO BE SOLVED: To provide a consistent process easily applied to a micro sensor chip, and combining the assembly of the sensor chip and the assembly of a filter to manufacture them. SOLUTION: A filter layer 50 is directly formed on a substrate 10 or a cover 30 by using a method for applying a solution in which powder composing a filter layer 50 or a compound composing the filter layer 50 is dispersed as an electrospray deposition method including: the process for spraying a mixed liquid and forming a fiber aggregates 64 while a voltage is applied between a nozzle (not shown) for spraying the mixed liquid of a phenol resin and an organic solvent and an electrode 11 formed on the substrate 10; and the process for hardening the fiber aggregate 64. COPYRIGHT: (C)2010,JPO&INPIT
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