| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor that has reduced alignment precision required in a lamination process and dispenses with any special processes, such as etching processing, and to provide a method of manufacturing the multilayer ceramic capacitor. SOLUTION: Internal electrodes 4a, 4b are alternately stacked inside a chip-like laminate 20, while sandwiching a ceramic layer. External electrodes 16a, 16b are formed at both the ends of the chip-line laminate 20 each. The internal and external electrodes 4a, 16a include Ag particles, and the internal and external electrodes 4b, 16b include Cu particles. The internal and external electrodes 4a, 16a including Ag particles are electrically connected each other, and the internal and external electrodes 4b, 16b including Cu particles are electrically connected each other. Different kinds of metals Ag-Cu of the internal and external electrodes 4b, 16a and 4a, 16b are separated and are not connected electrically. COPYRIGHT: (C)2010,JPO&INPIT
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