METHOD FOR ATTACHING PROTECTION TAPE AND APPARATUS FOR ATTACHING PROTECTION TAPE

摘要

A cooling plate having a cooling pipe meandering therein is provided in a laminated state on the rear surface of a chuck table which holds a semiconductor wafer from the rear surface by suction.  The chuck table is cooled by circulating a cooling medium in the cooling pipe.  The semiconductor wafer is held by suction in the state where the chuck table is cooled.  Furthermore, in the state where the chuck table is cooled, a protection tape is attached to the semiconductor wafer.  Namely, in the step of attaching the protection tape, the protection tape is attached to the front surface of the semiconductor wafer while the protection tape is being indirectly cooled via the semiconductor wafer cooled by being brought into direct contact with the chuck table.