| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-diffusible silicone resin composition excellent in heat-resistant coloration stability and light diffusibility, and to provide a sealed optical semiconductor product using the same. <P>SOLUTION: There are provided the light-diffusible silicone resin composition comprising (A) 100 pts.mass of an organopolysiloxane having two or more silanol groups in one molecule, (B) ≥3 pts.mass of an alkoxy group-containing polysiloxane which has two or more alkoxy groups bound to silicon atoms in one molecule, has an alkoxy group amount of ≥20 mass% in one molecule, and has a mol.wt. of ≥1,000, and (C) containing a zirconium metal salt and/or a gallium metal compound. The sealed optical semiconductor product is obtained by imparting the light-diffusible silicone resin composition to a LED chip and then heating the LED chip to cure the light-diffusible silicone resin composition, thus sealing the LED chip. <P>COPYRIGHT: (C)2010,JPO&INPIT |
