IC MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

Subject: to provide a wiring board with a substrate mounted having a low electrical resistance with a built-in inorganic substrate. Means to Solve the Problem: It is set forth such that a silicon substrate 62 is provided with a low-elasticity resin layer 60 being interposed on the multilayer build-up wiring board 100 and that the build-up wiring layers 16, 26 are provided on said silicon substrate 62. The conductor pads for mounting 36b of the multilayer build-up wiring board 100 and the build-up wiring layers 16, 26 are connected by the through-hole conductors 74 formed inside the through holes 64 of the silicon substrate 62. As the connection to interpose the silicon substrate 62 is made through said through-hole conductors 74 without the use of soldering, the electrical resistance of the internal wiring is low.