发明名称 |
BILAYER LAMINATED FILM FOR BUMP FORMATION AND METHOD OF BUMP FORMATION |
摘要 |
A negative radiation-sensitive two-layer laminated film for forming bumps includes a lower layer that includes a composition including a polymer (A) with a specific structural unit and an organic solvent (B). A process for forming bumps uses the laminated film. The negative radiation-sensitive two-layer laminated film for forming bumps permits excellent printing of a solder paste, is patternable with good configuration, and is easily peeled from a substrate. The bump-forming process using the laminated film provides the same effects. |
申请公布号 |
EP1739487(A4) |
申请公布日期 |
2010.04.21 |
申请号 |
EP20050710408 |
申请日期 |
2005.02.18 |
申请人 |
JSR CORPORATION |
发明人 |
SAKAI, HIROKO;OHTA, MASARU;INOMATA, KATSUMI;IWANAGA, SHIN-ICHIRO |
分类号 |
G03F7/11;G03F7/033;G03F7/09;H01L21/48;H01L21/60;H05K3/34 |
主分类号 |
G03F7/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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