A MICROPOROUS LAYER FOR LOWERING FRICTION IN METAL-FORMING PROCESSES

摘要

The invention is a microporous layer to be used in metal forming processes providing lower friction and improved resistance against galling. The layer is a thin, porous metallic film, which is electrochemically deposited on a metallic substrate, whereafter one of the metals of the deposited film is selectively removed by chemical etching, thereby leaving a micro- or even nanoporous layer on the surface of the substrate, which enhances lubricant entrapment leading to improved lubrication during metal forming processes.