| 摘要 |
The present invention relates to a heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, including: a fixed plate adhered and fixed to the projection-type IC package; and heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove. Therefore, there are advantages in that the heat dissipation plate can enhance not only heat dissipation efficiency but also adhesion performance by increasing the contact area with the projection-type IC package, and simultaneously can be simply produced, thereby reducing production costs. |
