发明名称
摘要 A light module includes light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal, communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages are disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.
申请公布号 JP4452495(B2) 申请公布日期 2010.04.21
申请号 JP20030500968 申请日期 2002.05.24
申请人 发明人
分类号 F21V29/00;F21K99/00;F21S2/00;F21S8/04;F21V5/04;F21V19/00;F21Y101/02;H01L25/075;H01L33/64 主分类号 F21V29/00
代理机构 代理人
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