| 摘要 |
PROBLEM TO BE SOLVED: To provide a vertical-type wafer boat that does not produce cracks in or between structural components, or deformation or destruction of the boat that does not need dummy wafers. SOLUTION: The vertical-type wafer boat has a bottom plate 2, three or more columns 3 with many support grooves 3a that support a semiconductor wafer W set up vertically on this bottom plate 2, and a disk-shaped top panel 4 prepared at the top of these columns 3, where three or more slits 4a are provided that are installed radially starting from the center going toward the periphery, and whose ends have not reached the periphery. COPYRIGHT: (C)2007,JPO&INPIT |
