DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

摘要

An element structure has a polyimide resin applied on a surface of a first substrate 5 to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured first polyimide layer 6A. A polyimide resin is applied on a surface of a second substrate 7A to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured second polyimide layer 6B. The cured first and second polyimide layers 6A and 8A are pressed on each other and heated to a bonding temperature, thereby joining the polyimide layers together. Thus, the first substrate 5 and the second substrate 7A are combined with the polyimide layer 11A being the bonded structure of the polyimide layers 6A and 8A therebetween.