| 摘要 |
The method comprises providing a first carrier substrate, which optionally has a partial or complete coating, optionally applying a partial release layer, completely applying multiple layers to be structured by a coating process, where the release layer has less adhesion to the first carrier substrate than the structured layer to the first carrier substrate and represents a negative image of the structured layer, and optionally register-exactly printing the structured layer with a laminating adhesive or hot-sealing lacquer which congruently takes place with the release layer. The method comprises providing a first carrier substrate, which optionally has a partial or complete coating, optionally applying a partial release layer, completely applying multiple layers to be structured by a coating process, where the release layer has less adhesion to the first carrier substrate than the structured layer to the first carrier substrate and represents a negative image of the structured layer, optionally register-exactly printing the structured layer with a laminating adhesive or hot-sealing lacquer which congruently takes place with the release layer and/or forms negative image of the structured layer, optionally laminating the layer structures that have the first carrier substrate, the release layer and the structured layer with a second carrier substrate, and removing the second carrier substrate, where the area of the first carrier substrate not adhesively remains with the release layer and the laminating adhesive and/or hot-sealing lacquer. The thickness of the release layer is more than 20 g/m 2>and the laminating step is not carried out and the release layer is removed in the removing step. The structured layer to the first carrier substrate has poor adhesion properties where the application of the release layer is not carried out. The thickness of the structured layer is 5 nm to 1 mu m. The structured layer is applied by printing, lacquering, spraying or vacuum coating process, made of metal, metal compound and alloy, consists of inorganic or organic semiconductor material or dielectrics, is a lacquer layer, and consists of individual layers. The first carrier layer has complete or partial layers. |
