| 摘要 |
An approach is provided for depositing a material onto a printed circuit board layer. The approach includes steps of treating surface of a base film, forming a tie layer on the base film, forming a metal conductive layer on the tie layer, and depositing a metal on the metal conductive layer by radiating electronic beams to form a metal plated layer thereon. The above steps are continuously performed in a vacuum chamber. The approach also includes an unwinding roller, film guide rollers, a surface treating part, tie layer and copper conductive layer, a vacuum depositing part for depositing a metal plated layer on the metal conductive layer by radiating electronic beams, and a winding roller, all of which are provided in a vacuum chamber.
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