发明名称 |
Integrated circuit package system employing wafer level chip scale packaging |
摘要 |
An integrated circuit package system that includes: providing a substrate with a protective coating; attaching a labeling film to a support member in a separate process; joining the protective coating and the labeling film; and dicing the substrate, the protective coating, and the labeling film to form the integrated circuit package system.
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申请公布号 |
US7700458(B2) |
申请公布日期 |
2010.04.20 |
申请号 |
US20060462545 |
申请日期 |
2006.08.04 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;KUAN HEAP HOE |
分类号 |
H01L21/301;H01L21/44;H01L21/46;H01L21/78 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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