发明名称 Multilayered circuit board design support method, program, and apparatus for suppressing thermal diffusion from solid-layer conductor to through hole
摘要 A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.
申请公布号 US7703064(B2) 申请公布日期 2010.04.20
申请号 US20050311655 申请日期 2005.12.20
申请人 FUJITSU LIMITED 发明人 ASHIDA TAKAYUKI;TSUBONE KENICHIROU
分类号 G06F17/50;H03K17/693;H05K1/00;H05K1/11 主分类号 G06F17/50
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