发明名称 Inspection contact structure and probe card
摘要 In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.
申请公布号 US7701234(B2) 申请公布日期 2010.04.20
申请号 US20070819274 申请日期 2007.06.26
申请人 TOKYO ELECTRON LIMITED;JSR CORPORATION 发明人 AMEMIYA TAKASHI;TSUKADA SHUICHI
分类号 G01R31/02;G01R31/26;H01R12/00 主分类号 G01R31/02
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