发明名称 Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern
摘要 A polymer compound that, within a chemically amplified positive resist system, exhibits a significant change in alkali solubility from a state prior to exposure to that following exposure, as well as a photoresist composition that includes such a polymer compound and a method for forming a resist pattern, which are capable of forming fine patterns with a high level of resolution. The polymer compound includes, as an alkali-soluble group (i), a substituent group in which a group selected from amongst alcoholic hydroxyl groups, carboxyl groups, and phenolic hydroxyl groups is protected with an acid dissociable, dissolution inhibiting group (ii) represented by a general formula (1) shown below: (wherein, A represents an organic group of 1 to 20 carbon atoms with a valency of at least n+1, and n represents an integer from 1 to 4).
申请公布号 US7700259(B2) 申请公布日期 2010.04.20
申请号 US20050578189 申请日期 2005.04.05
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 OGATA TOSHIYUKI;MATSUMARU SYOGO;HADA HIDEO;YOSHIDA MASAAKI
分类号 G03C1/00;C07C69/54;C07C69/74;C08F8/00;C08F20/20;C08F220/28;C08F222/10;C08F232/08;G03F7/004;G03F7/039 主分类号 G03C1/00
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