发明名称 Element arrangement method
摘要 An element arrangement board and method are provided. Where the element size is comparatively small with respect to the distance in element arrangement and the density of arranged elements is low, the elements can also be arranged with certainty and efficiently in a short period of time. The element arrangement board has an arrangement face on which fitting holes for receiving elements are formed and tapered faces are formed around the fitting holes and inclined downwardly toward the fitting holes. Elements to be arranged are mixed in fluid. The fluid is supplied to the arrangement face of the element arrangement board. The elements are acted upon by force toward the fitting holes on the tapered faces so that they are fitted in a self-aligned fashion into the fitting holes and arranged on the element arrangement board.
申请公布号 US7698800(B2) 申请公布日期 2010.04.20
申请号 US20050034003 申请日期 2005.01.11
申请人 SONY CORPORATION 发明人 WATANABE TOSHIHIKO
分类号 B23Q7/00;H01L23/12;B05D5/00;B32B3/00;H01L21/68;H01L21/98 主分类号 B23Q7/00
代理机构 代理人
主权项
地址