发明名称 |
Semiconductor device package and manufacturing method |
摘要 |
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.
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申请公布号 |
US7700411(B2) |
申请公布日期 |
2010.04.20 |
申请号 |
US20070852079 |
申请日期 |
2007.09.07 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
YANG JUN YOUNG;JOO YOU OCK;JUNG DONG PIL |
分类号 |
H01L21/44;H01L21/48 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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