Methods and apparatus for implementing a stacked memory programmable integrated circuit system in package

摘要

Methods and apparatus for implementing a stacked memory-programmable integrated circuit system-in-package are described. An aspect of the invention relates to a semiconductor device. A first integrated circuit (IC) die is provided having an array of tiles that form a programmable fabric of a programmable integrated circuit. A second IC die is stacked on the first IC die and connected therewith via inter-die connections. The second IC die includes banks of memory coupled to input/output (IO) data pins. The inter-die connections couple the IO data pins to the programmable fabric such that all of the banks of memory are accessible in parallel.