| 摘要 |
<p>PURPOSE: The pad structure of a semiconductor integrated circuit apparatus is provided to prevent the roll up phenomenon of the pad during a wire bonding process by installing fixing units with a contact plug shape on the edge of the pad. CONSTITUTION: A semiconductor substrate(100) includes circuit patterns. A pad(200) is arranged on the upper side of a semiconductor substrate. At least a pair of fixing units(170) are arranged on the edge of the pad. The fixing units are opposed to each other. The fixing units are contact plugs which electrically connect the semiconductor substrate and the pad. An insulation layer is interposed between the semiconductor substrate and the insulation layer. A buffer metal pattern array(110) is formed between the semiconductor substrate and the insulation layer.</p> |
