PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board(PCB) and a method for manufacturing the same are provided to form a high density PCB by securing a step variation between circuit patterns. CONSTITUTION: A plating resist which corresponds to a circuit pattern is formed on the seed layer of a carrier(S110). The surface of the plating resist is roughened(S120). The seed layer is electrolytic-plated into an electrode(S130). A conductive relief pattern is formed by removing the plating resist(S140). The carrier is stacked on an insulation layer(S150). The carrier is removed(S160). The circuit pattern is formed by removing the seed layer(S170). The circuit pattern is formed on the one side of the insulation layer. A ground layer is formed on the other side of the insulation layer.