| 摘要 |
PURPOSE: A printed circuit board and a method for manufacturing the same are provided to prevent the collapse of bumps by forming reinforce materials on the lateral side of the bumps. CONSTITUTION: A first and a second circuit layers(120, 130) are arranged on the both side of a core layer(110). A bump(140) electrically connects the first and the second circuit layers through the core layer. A reinforce material(150), which is composed of an insulation layer, covers the lateral side of a bump. The core layer insulates the first and the second circuit layers from each other.
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