SYSTEMS AND METHODS FOR IMPLEMENTING A WAFER LEVEL HERMETIC INTERFACE CHIP

摘要

PURPOSE: A system and a method for implementing a wafer level hermetic interface chip(HIC) are provided to improve the yield by hermetically sealing microelectromechanical system device. CONSTITUTION: An HIC(11) includes a plurality of vias(28) and a sealing ring(18). A plurality of substrate mesas(20) includes an etched part on the first side of the HIC. The HIC includes an external conductive lead(30) which is connected through the vias. The vias include a plurality of conductive traces(26) which is supplied from the first side of the HIC to the second side of the HIC. At least one getter(24) is arranged on the surface of the first side of the HIC in order to provide the sufficient capacity for the gettering. The vias pass through the substrate mesas.