LEAD FRAME FOR LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light emitting diode frame for a light emitting diode package is provided to reduce the electric resistance by forming a silver-aluminum alloy plating layer on the upper side of a nickel or copper plating layer. CONSTITUTION: A lead frame(120) for a light emitting diode package includes a base material, a plating layer and a alloy plating layer. The base material is composed of copper(Cu) or iron(Fe)-nickel(Ni) alloy. A nickel or copper plating layer(122) is formed on at least one side of the base material. A silver(Ag)-aluminum(Al) alloy plating layer(123) is formed on the upper side of the nickel or copper plating layer. The thickness of the nickel or copper plating layer is more than 100nm and less than 500nm.