SOLDER BALL PAD, PRINT CIRCUIT BOARD COMPRISING THE PAD AND METHOD OF MANUFACTURING THE BOARD

摘要

PURPOSE: A solder ball pad, a printed circuit board including the same, and a manufacturing method thereof are provided to improve reliability of the printed circuit board by preventing a crack or damage to a substrate and the cut of a circuit pattern. CONSTITUTION: A solder ball pad(6) is formed on an insulation layer(1). A gold plating layer(4,5) is formed on a part of the upper side of the solder ball pad and is not formed on the edge of the upper side of the solder ball pad. A PSR(Photo Solder Resist)(2) is coated on the insulation layer including the edge of the upper side of the solder ball pad. A boundary surface of the PSR and the Ni/Au layer is positioned on the center part of the upper side of the solder ball pad.