CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL

摘要

This invention provides a circuit connection material (10) containing an adhesive composition (11) and electroconductive particles (12). The electroconductive particles (12) have protrusions (14) comprising one or at least two metal layers (22) on a nucleus (21). The metal layer (22) is formed at least on the surface of the protrusion (14). The metal layer (22) is formed of nickel or a nickel alloy, and the compression modulus of the electroconductive particles (12) at a compression level of 20% is 100 to 800 kgf/mm.