发明名称 IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>PURPOSE: An image sensor module and a method for manufacturing the same are provided to apply the image sensor module to a variety of appliances by arranging a connection unit on a transparent substrate in which a photo diode unit is formed. CONSTITUTION: A photodiode unit(113) is arranged in an active region(AR) and converts light into electrical signal. The pads are arranged in a peripheral region and electrically connected to the photo diode unit. A connection region(CR) is arranged along the peripheral region. Re-wirings(120) are electrically connected to the pads. A transparent substrate(130) covers the photo diode unit and the pads and exposes at least part of the re-wirings. A connection wiring(140) is electrically connected to the re-wirings. A connection unit(150) is connected to the connection wiring.</p>
申请公布号 KR20100039686(A) 申请公布日期 2010.04.16
申请号 KR20080098755 申请日期 2008.10.08
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KIM, SUNG MIN
分类号 H01L21/8247 主分类号 H01L21/8247
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