发明名称 PHOTOSENSITIVE RESIN COMPOSITION, ARTICLE, AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is easy to synthesize and inexpensively available, for achieving a dissolution contrast irrespective of the chemical structure of the finally-obtained polyimide and for achieving a pattern with a good shape. <P>SOLUTION: The photosensitive resin composition includes a polyimide precursor having a repeating unit expressed by formula (1) having a hemiacetal structure in a side chain and a compound that generates a carboxylic acid by an action of light. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010085430(A) 申请公布日期 2010.04.15
申请号 JP20080251134 申请日期 2008.09.29
申请人 DAINIPPON PRINTING CO LTD 发明人 SAKAYORI KATSUYA
分类号 G03F7/023;C08G73/10;G02B5/20;G03F7/004;G03F7/028;G03F7/40 主分类号 G03F7/023
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