| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board suitable for forming fine conductive circuits. <P>SOLUTION: This multilayer printed wiring board 100 has: a first insulative material; a first conductive circuit formed on the first insulative material; a second insulative material formed on the first insulative material and the first conductive circuit, and having an opening that reaches the first conductive circuit; a second conductive circuit formed on the second insulative material; and a via conductor formed in the opening and connecting the first conductive circuit and the second conductive circuit. In the multilayer printed wiring board, an insulative thin film is formed on at least a part of a surface including a side surface of the first conductive circuit, and the via conductor is directly connected to the surface of the first conductive circuit exposed through the opening. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
