| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make compatible the reuse of a chip and the switching of a dope. <P>SOLUTION: This solution film forming method comprises steps of: preparing a raw material dope 48 by dissolving a raw material TAC in a solvent in a raw material dope preparation facility 11; changing over a three-way valve 15 by a control part 16 to send the raw material dope 48 to a solution film forming facility 13; forming the film 69 by using the raw material dope 48 in the solution film forming facility 13; cutting the film 69 and removing hems in hem cutting units 70a, 70b; crushing the hems into chips 76 by crushers 71a, 71b; sending the chips 76 to chip dope preparation facility 12 by an air sending unit 77; mixing the chips 76 with the solvent 96 in the chip dope preparation facility 12 and keeping the mixture at a temperature of 20°C to the boiling point of the solvent 96 to dissolve the chips 76 in the solvent and prepare a chip dope 98; and changing over the three-way valve 15 by the control part 16 to send the chip dope 98 to the solution film forming facility 13. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
