| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for autonomously controlling the position and posture of a small-sized semiconductor chip on a mounting board. SOLUTION: A semiconductor chip carrying and alignment method for carrying the semiconductor chip formed into a chip to the electrode of a board in a desired position and posture comprises processes of separately providing a layer comprising a hydrophilic material and a layer comprising a hydrophobic material in a region excluding the electrode on the surface of the semiconductor chip including the semiconductor chip in a droplet, carrying it to the electrode of the mounting board and connecting the semiconductor chip to the electrode of the mounting board. In the processes, the semiconductor chip autonomously controls the alignment of the relative position and posture with the mounting board by the action of the hydrophilic material and the hydrophobic material of the semiconductor chip and a droplet. COPYRIGHT: (C)2010,JPO&INPIT |
