发明名称 REFRIGERATION CAPACITY BANKING FOR THERMAL CYCLING
摘要 <p>A thermal cycling system includes a structure defining a load space, a heating assembly positioned to heat to the load space, and a cooling assembly positioned to cool the load space. The cooling assembly includes a refrigeration circuit and a banking circuit. The refrigeration circuit has a compressor, a refrigeration condenser, a first refrigeration evaporator in direct thermal communication with the load space, a second refrigeration evaporator in parallel with the first evaporator, and primary refrigerant circulating throughout the refrigeration circuit. The banking circuit is gravity fed and includes a banking condenser, a banking evaporator positioned to cool the load space, and a banking refrigerant circulating throughout the banking circuit. The banking condenser includes a collection reservoir to store liquid banking refrigerant and is in thermal communication with the second refrigeration evaporator.</p>
申请公布号 WO2010042272(A1) 申请公布日期 2010.04.15
申请号 WO2009US53908 申请日期 2009.08.14
申请人 VENTUREDYNE, LTD.;IMMINK, DARIN, E.;PETERSON, CLINTON, A.;VELDT, ANDREW, R. 发明人 IMMINK, DARIN, E.;PETERSON, CLINTON, A.;VELDT, ANDREW, R.
分类号 G01M99/00;F25B5/02;F25B7/00;F25B29/00 主分类号 G01M99/00
代理机构 代理人
主权项
地址