发明名称 METHOD FOR PROTECTING A CONDUTIVE MATERIAL STRUCTURE PROVIDED ON A CARRIER
摘要 <p>A method for protecting a conductive material structure provided on a carrier comprises the steps of covering (26) the conductive material structure with an environmental protection layer except for in a set of pre-specified areas, where said set of pre-specified areas includes at least one contact area on the conductive material structure; and placing (28) electrical contact enhancing material on the contact area, which placing of electrical contact enhancing material is performed after the conductive material structure has been covered with the environmental protection layer.</p>
申请公布号 WO2010040399(A1) 申请公布日期 2010.04.15
申请号 WO2008EP63475 申请日期 2008.10.08
申请人 LAIRD TECHNOLOGIES AB;PALIN, ULF;NILSSON, JERRY;HIRVONEN, ELIS 发明人 PALIN, ULF;NILSSON, JERRY;HIRVONEN, ELIS
分类号 H01Q1/38;H01Q1/40;H01Q9/04;H05K3/24;H05K3/28 主分类号 H01Q1/38
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