| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the connection reliability between an electrode that is provided in a semiconductor element and a bump electrode. <P>SOLUTION: A semiconductor module 30 is provided with an element mounting substrate 10 and a semiconductor element 50 mounted thereon. The element mounting substrate 10 includes an insulating resin layer 12, a wiring layer 14 provided on one main surface S1 of the insulating resin layer 12, and a bump electrode 16 that is electrically connected with the wiring layer 14 to project to the insulating resin layer 12 side from the wiring layer 14. The semiconductor element 50 has a semiconductor substrate 51 and an element electrode 52 opposed to each of the bump electrodes 16. Since the surface of the metal layer 55 provided on the element electrode 52 has an uneven shape, the adhesiveness with the insulating resin layer 12 is improved. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
