METHOD AND APPARATUS FOR FITTING RELEASE FILM USED FOR COMPRESSION RESIN ENCAPSULATION MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of efficiently fitting a release film onto a cavity face of a lower mold when performing compression resin encapsulation molding of an electronic component such as semiconductor element by using the release film. SOLUTION: The method for fitting release film used for compression resin encapsulation molding comprises: a process of feeding a film 16 for releasing a molded product onto the cavity face 106 of a lower mold while separating an upper mold 6 and a lower mold 10 for resin encapsulation molding from each other; a subsequent process of sucking and supporting a peripheral portion in the release film 16 stretched on the cavity face 106 of the lower mold corresponding to an outer peripheral part of the cavity part of the lower mold; and a process of expanding the release film 16 by supplying compression air A1 to the release film 16 to fit (211b) the release film 16 onto the cavity face 106 of lower mold in the state of sucking and supporting the peripheral portion. Therein, by jointly using such a pressure reduction operation as to suck (22) the release film 16 from the side of the cavity face 106 of the lower mold, the fitting of the release film 16 is assisted. COPYRIGHT: (C)2010,JPO&INPIT