| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit device improved in adhesion strength between an island and a sealing resin; and a method of manufacturing the same. <P>SOLUTION: This circuit device 10 includes: the island 16; leads 12 arranged around the island 16 and each having an undersurface exposed outside; and a semiconductor element 20 mounted on the island 16 and electrically connected to the leads 12 through metal thin wires. Recessed parts 28 each formed in a depression-like form are arranged on the upper surface of the island 16, and, by closely attaching the sealing resin 14 to the recessed parts 26, the adhesion strength between the island 16 and the sealing resin 14 is improved. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
