发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting device which can hold a rectangular package substrate by a holding table to cut it, wherein safety is secured even when rotating the holding table, and setup and dressing are possible. SOLUTION: A holding table 2 is configured as follows: a rectangular chucking holding part 21 is arranged at the center of a rotatable disk plate 20; a magnet part 22 for magnetizing a frame body of a frame is arranged around the chucking holding part 21; a dressing board support part 23 for supporting a dressing board and a detection plate support part 24 for supporting a detection plate with which a cutting blade is brought into contact when an original position of the motion in a vertical direction of the cutting blade is detected at a position in point symmetry with respect to the dressing board support part 23 are disposed on the outer peripheral side of the magnet part 22. In a state that a workpiece supported by the frame via an adhesive tape is held by a holding table 2, the dressing board support part 23 and the detection plate support part 24 are exposed on the outer peripheral side of the frame body of the frame. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010087122(A) 申请公布日期 2010.04.15
申请号 JP20080252992 申请日期 2008.09.30
申请人 DISCO ABRASIVE SYST LTD 发明人 MAEDA YASUSHI
分类号 H01L21/301 主分类号 H01L21/301
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