MANUFACTURING METHOD OF FUNCTIONAL DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, WHICH USES FUNCTIONAL DEVICE MANUFACTURED BY THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a functional device which is superior in mass production and can improve performance without damaging the functional device at the time of manufacturing, and to provide a manufacturing method of the semiconductor device using the method. SOLUTION: In the manufacturing method of the functional device 10, a hollow 5 which spatially separates a part of a functional thin film 2 formed on one surface of a silicon substrate (substrate) 1 is formed in the silicon substrate 1. When forming and separating the functional device 10 on one surface of a silicon wafer (wafer) 3 becoming a base, a dicing sheet 7 is stuck to the other surface of the silicon wafer 3 and a temporary fixing sheet 6 is directly stuck to one surface. The silicon wafer 3 is cut from a temporary fixing sheet 6, the temporary fixing sheet 6 is peeled from the functional device 10 and then organic substances existing on surfaces of the functional devices 10 are removed by dry processing in the manufacturing method of the functional device. COPYRIGHT: (C)2010,JPO&INPIT