发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To expand a receive margin in inductive coupling wireless communication between semiconductor chips. SOLUTION: For example, a transmission semiconductor chip LSI_TX generates a current signal ISIG on a transmission coil L_TX in "1" level transmission and does not generate the ISIG in "0" level transmission. A semiconductor chip LSI_RX for receiving first resets the integration result of an integration circuit ITG by means of a reset switch RSW. Subsequently, a voltage signal VSIG induced associated with ISIG on a receive coil L_RX is amplified by means of an amplification circuit AMP. At the same time, the amplification result is integrated by means of the ITG. The integration result is latched by means of a latch circuit LT. Consequently, timing control should be made so that the VSIG is positioned within the time period TM from the operation of the RSW to the latch by the LT. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010087398(A) 申请公布日期 2010.04.15
申请号 JP20080257291 申请日期 2008.10.02
申请人 HITACHI LTD 发明人 SAEN MAKOTO;OSADA KENICHI;NAKAMOTO KAZUHIRO;SUZUKI KO;MIYAZAKI SHINYA;FUJIKI KAZUNARI
分类号 H01L25/065;H01L25/07;H01L25/18;H04B5/00 主分类号 H01L25/065
代理机构 代理人
主权项
地址