发明名称 |
COMPOUND FOR GAP-FILLING OF SEMICONDUCTOR DEVICE AND COATING COMPOSITION USING THE SAME |
摘要 |
A compound for filling small gaps in a semiconductor device and a composition comprising the compound are provided. The composition can completely fill holes having a diameter of 70 nm or less and an aspect ratio (i.e. height/diameter ratio) of 1 or more in a semiconductor substrate without any defects, e.g., air voids, by a general spin coating technique. In addition, the composition can be completely removed from holes at a controllable rate without leaving any residue by the treatment with a hydrofluoric acid solution after being cured by baking. Furthermore, the composition is highly stable during storage.
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申请公布号 |
US2010093923(A1) |
申请公布日期 |
2010.04.15 |
申请号 |
US20070451247 |
申请日期 |
2007.12.31 |
申请人 |
WOO CHANG SOO;SUNG HYUN HOO;BAE JIN HEE;UH DONG SEON;KIM JONG SEOB |
发明人 |
WOO CHANG SOO;SUNG HYUN HOO;BAE JIN HEE;UH DONG SEON;KIM JONG SEOB |
分类号 |
C08L83/05;C08G77/04;C08G77/12;C08L83/06 |
主分类号 |
C08L83/05 |
代理机构 |
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代理人 |
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