| 摘要 |
Apparatus for housing electronic components comprising a heated enclosure comprising a bottom, a top, three sides, a substantially open front and a heating element for transmitting heat to enclosure surfaces. Perforations are located in the heated enclosure to facilitate the passage of air from one side of the heated enclosure to the other. A plenum is connected to the perforations, the plenum being configured to transmit air between the outside and inside of the heated enclosure. Completing the apparatus as control electronics comprising a power source and temperature monitoring and feedback circuitry, and insulation covering a heated portion of the heated enclosure.
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